A Maven in Electronic Thin Film Science--Professor King - Ning Tu
Professor; B.S., National Taiwan University; M.S., Brown University; Ph.D. in Applied Physics, Harvard University(1968) ; Senior Manager of Materials Science Department at IBM T.J. Watson Research Center; Science Research Council Senior Research Fellow and The Royal Society Guest Research Fellow at Cavendish Laboratory, UK; Fellow of American Physical Society; Fellow of the Metallurgical Society; Overseas Fellow of Churchill College; Application to Practice Award of the Metallurgical Society; Alexander von Humboldt Research Award for senior US scientists; President of the Materials Research Society in 1981, Member of Academia Sinica, Republic of China.
As of April 2007, the total number of citation N = 10186.
h-factor = 56.
a-factor = N/(h x h) = 3.25. 
RESEARCH DESCRIPTION
Our research interest is in wafer-based and flux-driven materials science. Modern microelectronic, opto-electronic, bio-sensor, and MEMS devices are built on wafers, involving the growth or removal of mono-layers of atoms from the wafer surface or an interface. They are open systems, in which the initial wafer surface area is constant and the flux-driven processes can come from atoms, molecules, or energy beams. Specifically, we concentrate on interfacial reactions, including metal-Si reaction, Cu-Sn reaction in solder joints, nanoscale interdiffusion and reaction, polarity effect of electromigation on interfacial reaction, and kinetic theories of interfacial reaction.
Our major research areas are (1) Cu-Sn reactions in Pb-free solder metallurgy for electronic packaging technology, (2) Advanced materials reliability problems of microelectronic devices, especially the interaction among electromigration, chemical reaction, and mechanical stress in flip chip technology, and (3) Nanoscale interdiffusion and reactions. In addition, we also conduct exploratory research on (4) Interaction of implanted metallic atoms with dislocations and grain boundaries in Si, and (5) Kinetic theories of interdiffusion and reactions.
On Pb-free solder metallurgy, we study the applications of eutectic SnAg, SnAgCu, SnCu, SnZn as solder bumps to flip chip technology. The wetting reaction and solid state aging of these Pb-free alloys with thin film under-bump-metallization are of interest. Due to the large difference in thermal expansion coefficients between the Si chip and its packaging substrate, the solder joints are stressed. In turn, the stress affects chip-packaging interaction and the integrity of Cu/ultra low k multi-layered interconnect structure on the chip. The diameter of the solder balls is approaching 50 mm, so electromigration becomes a reliability issue. The advanced materials reliability problems due to a combined action from chemical, electrical, and mechanical forces in flip chip technology will be studied systematically. Electromigration induced microstructure evolution and grain rotation in Pb-free solder alloys requires investigation. A unique nature of most Pb-free solders is that they are very rich in Sn, hence the old topics of Sn whisker, Sn pest, and Sn cry are of interest again. We shall combine micro-diffraction in synchrotron radiation, focused ion beam imaging, and cross-sectional transmission electron microscopy to study these issues. In optical packaging, we interest in how to wet an optical fiber by molten solder and how to achieve high precision alignment by solder joints.
On interconnect technology, our research emphasizes the effect of current crowding on vacancy and solute diffusion in electromigration. The nature of the electromigration force along the direction of current density gradient, i.e., normal to the current flow, will be explored. Why actual failures tend to initiate in the low current density regions will be studied. The effect of current crowding on joule heating as well as on stress concentration will be analyzed. The nature of back stress induced by electromigration and whether or not there is back stress in Cu interconnect will be investigated.
On nanoscale interdiffusion and reactions, we study the reaction of ultra thin metal films on nano Si wires and vice versa, and the nanoscale explosion in multi-layered nano-thickness thin films. Hollow nanostructure formation based on the Kirkendall effect will be investigated.
On extended defects in Si, we study the nucleation, growth, and ripening of dislocation loops formed by ion implantation and post-implantation annealing. The interaction of these loops with metallic atoms such as Ni and Co will be investigated. We also investigate the nano-grid of screw dislocation network, or very small angle twist-type grain boundary in Si bicrystals formed by wafer bonding. Again we examine the interaction of implanted metallic atoms with these dislocation networks.
Kinetic theory of phase transformations in open systems under the constraint of a constant surface area applies to phase changes on a wafer or on a given area of surface or interface will be developed. For example, the constraint of constant area is fundamental to the ripening of hemispherical scallops during the reaction between molten solder and Cu. The existence of nano channels between the scallops will be studied. The constraint of constant area also applies to the linear rate of grain growth in thin film deposition.
2006-2007 Publications:
A. M. Gusak, G. V. Lutsenko, and K. N. Tu, “Ostwald ripening with non-equilibrium vacancies,” Acta Mat., 54, 785-791 (2006).
Lingyun Zhang, Shengquan Ou, Joanne Huang, K. N. Tu, Stephen Gee, and Luu Nguyen, “Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints, “ Appl. Phys. Lett., 88, 012106 (2006).
S. W. Liang, T. L. Shao, Chih Chen, Everett C. C. Yeh, and K. N. Tu, “Relieving the current crowding effect in flip-chip solder joints during current stressing, “ J. Mater. Res., 21, 137-146 (2006).
M. O. Alam, B. Y. Wu, Y. C. Chan, and K. N. Tu, "High electric current density induced interfacial reactions in the micro Ball Grid Array (µBGA) solder joint" Acta Mat., 54, 613-621 (2006).
J. W. Nah, Fei Ren, K. N. Tu, Sridharan Venk, and Gabe Camara, “Electromigration in Pb-free flip chip solder joints on flexible substrates,“ J. Appl. Phys., 99, 023520 (2006).
Young-Woo Okm Tae-Yeon Seong, Chel-Jong Choi, and K. N. Tu, “Field emission form Ni-disilicide nanorods formed by using implantation of Ni an Si couples with laser annealing,” Appl. Phys. Lett., 88, 043106 (2006).
Z. H. Gan, W. Shao, M. Y. Yan, A. V. Vairagar, T. Zaporozhets, M. A. Meyer, A. Krishnamoorthy, , K. N. Tu, A. Gusak, E. Zschech, and S. G. Mhailkar, “Understanding the impact of surface engineering, structure, and design on electromigration through Monte Carlo simulation and in-situ SEM studies,” in “Stress-induced phenomena in metallization,” AIP Proceedings of 8th Workshop on Stress-induced Phenomena in metallization, Dresden, Germany, vol. 817, p.34-42 (2006).
M. Y. Yan, K. N. Tu, A. V. Vairagar, M. A. Meyer, H. Geisler, A. Preusse, and E. Zschech, “Effect of overburden thicknss on the copper microstructure of dual-inlaid interconnect structures,” AIP Proceedings of 8th Workshop on Stress-induced Phenomena in metallization, Dresden, Germany, vol. 817, p. 211-216 (2006).
M. Y. Yan, K. N. Tu, A. V. Vairagar, S. G. Mhaisalkar, and Ahila Krishnamoorthy, “A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects,” Microelectronics Reliability, 46, 1392-1395 (2006).
K. N. Tu, M. Y. Yan, Fei Ren, Joannne Huang, Emily Ou, L. Y. Zhang, and J. W. Nah, “Electromigration in flip chip solder joints,” AIP Proceedings of 8th Workshop on Stress-induced Phenomena in metallization, Dresden, Germany, vol. 817, p. 327-338 (2006)
Jae-Woong Nah, Fei Ren, Kyung-Wook Paik, and K. N. Tu, “Effect of electromigration on mechanical shear behavior of flip chip solder joints,” J. Mater. Res., 21, 698-702 (2006).
Annie T. Huang, A. M. Gusak, K. N. Tu, and Yi-Shao Lai, “Thermomigration in SnPb composite flip chip solder joints,” Appl. Phys. Lett., 88, 141911 (2006).
S. W. Liang, Y. W. Chang, T. L. Shao, Chih Chen, and K. N. Tu, “Effect of three-dimensional current and temperature distribution on void formation and propagation in flip chip solder joints during electromigration,” Appl. Phys. Lett., 89, 022117 (2006).
Xi Zhang, K. N. Tu, Y. H. Xie, C. H. Tung, and S. Y. Xu, “Single-step fabrication of Ni films with arrayed macropores and nanostructured skeletons,” Adv. Mater., 18, 1905-1909 (2006).
Xi Zhang, K. N. Tu, Y. H. Xie, and C. H. Tung, “High aspect ration Ni structure fabricated by electrochemical replication of hydrofluoric acid etched Si,” Electrochemical and Solid State Letters, 9, C150-C152 (2006).
R. Agarwal, Shengquan E. Ou, and K. N. Tu, “Electromigration and critical product in eutectic SnPb solder lines at 100 C,” J. Appl. Phys., 100, 024909 (2006).
Annie T. Huang, K. N. Tu and Yi-Shao Lai, “Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints,” J. Appl. Phys., 100, 033512 (2006).
Fei Ren, Jae-Woong Nah, K. N. Tu, Bingshou Xiong, Luhua Xu, and John H. L. Pang, “Electromigration induced ductile-to-brittle transition in lead-free solder joints,” Appl. Phys. Lett., 89, 141914 (2006).
Luhua Xu, John H. L. Pang and K. N. Tu, “Effect of electromigration-induced back stress gradient on nano-indentation marker movement in SnAgCu solder joints,” Appl. Phys. Lett., 89, 221909 (2006).
Fan-Yi Ouyang, K. N. Tu, Yi-Shao Lai, and Andriy M. Gusak, “Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration.” Appl. Phys. Lett., 89, 221906 (2006).
Xi Zhang and K. N. Tu, “Preparation of hierarchically porous nickel from macroporous silicon,” J. of Am. Chem. Soc., Communication, 128 (47), 15306-15307, Nov. 2006.
Xi Zhang, F. Ren, M. S. Goorsky, and K. N. Tu, “Study of the initial stage of electroless nickel deposition on Si (100) substrates in aqueous alkaline solution”, Surface and Coatings Technology, 201 (6), 2724 -2732, Dec. 2006.
Jae-Woong Nah, J. O. Suh, K. N. Tu, Seung Wook Yoon, Vempati Srinivasa Rao, Vaidyanathan Kripesh, and Fay Hua, “Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect,” J. Appl. Phys., 100, 123513 (2006).
Zhenghao Gan, A. M. Gusak, W. Shao, Zhong Chen, S. G. Mhaisalkar, T. Zaporozhets, and K. N. Tu, “Analytical modeling of reservoir effect on electomigration in Cu interconnects,” J. Mater. Res., 22, 152-156 (2007).
Luhua Xu, Pradeep Dixit, Jianmin Miao, John H. L. Pang, Xi Zhang, and K. N. Tu, “Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins,” Appl. Phys. Lett., 90, 033111 (2007).
Chengkun Xu, Xi Zhang, K. N. Tu, and Y. H. Xie, “Nickel displacement deposition of porous silicon with ultrahigh aspect ratio,” J. of Electrochemical Society, 154(3), D170-D174 (2007).
K. N. Tu, Chin Chen, and Albert T. Wu, “Stress analysis of spontaneous Sn whisker growth,” J. Mater. Sci: Mater. Electron., 18, 269-281 (2007).
W. Shao, S. G. Mhaisalkar, T. Sritharan, A. V. Vairagar, H. J. Engelmann, O. Aubel, E. Zschech, A. M. Gusak, and K. N. Tu, „Direct evidence of Cu/cap/liner edge being the dominant electromigration path in dual damascene Cu interconnects,“ Appl. Phys. Lett., 90, 052106 (2007).
Xi Zhang, Zhong Chen, and K. N. Tu, "Immersion nickel deposition on blank silicon in aqueous solution containing ammonium fluoride", Thin Solid Films, 515, 4696-4701 (2007).
Jae-Woong Nah, Kai Chen, K. N. Tu, Bor-Rung Su, and Chih Chen, “Mechanism of electromigration-induced failure in flip chip solder joints with a 10 micron thick Cu under-bump-metallization”, J. Mater. Res., 22, 763-769 (2007).
Chengkun Xu, Mingheng Li, Xi Zhang, K. N. Tu, and Y. H. Xie, “Theoretical studies of displacement deposition of Ni into porous Si with ultrahigh aspect ratio”, Electrochimica Acta, 52, 3901-3909 (2007).
J. W. Jang, J. K. Lin, D. R. Frear, T. Y. Lee, and K. N. Tu, “Ripening-assisted void formation in the matrix of Pb-free solder joints during solid-state aging,” J. Mater. Res., 22, 826-830 (2007).
List of thesis students in the last five years
Ph.D. students:
Dr. Harqkyun Kim, 1996 Dissertation title: "Instability at wetting tip and wetting interface of Sn-based solders on Cu substrate." Now at BMR, Orange County, CA.
Dr. Jia-Sheng Huang, 1997 Dissertation title: "Polarity effect on failure of Ni and Ni2Si contacts on p+-Si and n+-Si under high current densities." Now at Agere, Alhambra, CA.
Dr. Patrick G. Kim, 1998 Dissertation title: "Wetting behaviors of Pb-based and Pb-free solders on Au, Pd, and Ni substrates." Now at Amkor Technology, Chandler, AZ.
Dr. Lowen Chow, 1999 Dissertation title: "Structure and mechanical propertes of low dielectric constant xerogel thin films" Now at Intel, Santa Clara, CA.
Dr. Chien-Neng Liao, 1999 Dissertation title: "Thermoelectric characterization of Si thin films in SOI wafers and thermal conductivity of low dielectric constant thin films." Now assistant professor at National Tsing Hua University, Hsinchu, Taiwan, ROC.
Dr. Chih Chen, 1999 Dissertation title: "Grain boundary structure in twist-type Si bicrystals made from SOI and dopant activation in SOI by high density currents." Now assistant professor at National Chiao Tung Univeristy, Hsinchu, Taiwan, ROC (starting 08/01/00).
Dr. Dawei Zheng, 1999 Dissertation title: “Measurement of local stress for microelectronics applications,” Now at Lightcrosss, Los Angeles, CA.
Dr. Chengyi Liu, 3/00, Ph.D. Dissertation on "Wetting behavior and electromigration of SnPb solders as a function of alloy composition." Now assistant professor at National Central University, Chungli, Taiwan, ROC.
Dr. Taek Yeong Lee, 2001 Dissertation title: "Electromigration and solid state aging of Pb-free flip chip solder joints and synchrotron radiation study of Sn whisker growth," Now at AT&T Bell Lab., Lucent Technologies, Murray Hill, NJ.
Dr. Peter Sangwoo Nam, 11/01, Dissertation title: "GaAs backside through chip via hole integration using inductively coupled plasma etching." Now at TRW, Redondo Beach, CA.
Dr. Woojin Choi, 2002 Dissertation title "Reliability of Pb-free solders in electronic packaging technology." Now at Intel, Chandra, AZ.
Dr. Hua Gan, 2004 Dissertation Title, “Polarity effect of electromigration on intermetallic compound formation in Pb-free solder V-groove samples.” Now at IBM T. J. Watson Research Center, Yorktown Heights, NY.
Albert T. C, Wu, 12/04, Ph.D. dissertation on "Electromigration and Microstructure Evolution in Anisotropic Conducting Tin Studied by Synchrotron X-ray Microdiffraction." Now at Advanced Light Source, Lawrence Berkeley National Laboratory, Berkeley, CA.
Dr. Emily Shengquan Ou, 2005 Dissertation Tiltle, "The polarity effect of electromigration on intermetallic compound formation and back stress in V-groove solder lines." Now at Intel, Chandler, AZ.
M.Sc. students:
Wang Yang, 1995 Thesis title: "Ultra-fast soldering reaction of eutectic SnPb and eutectic SnBi on Pd surfaces." Now at Vitesse Semiconductor Corp., Camarillo, CA.
Ann A Liu, 1996 Thesis title: "Spalling of Cu-Sn compounds in the soldering reaction between eutectic SnPb and Au/Cu/Cr thin films." Now at TRW, Redondo Beach, CA.
Sharon S. Y. Huang, 1997 Thesis title: "Ultra-thin TaN as diffusion barrier for Cu interconnects." Now at Applied Materials, Santa Clara, CA.
Jessica P. Almaraz, 1998 Thesis title: "Morphology of the wetting reaction of Pb-free solder (eutectic SnAg and eutectic SnBi) on Ni substrates." Now at Northrop, Palmdale, CA.
Ben Zhengyi Jia, 1997 Thesis title: “Stress of Ni thin films on Si wafers,” Now a graduate student in Dept. EE, UCLA.
Yi-Pin Tsai, 1999 thesis title: “Microstructure and properties of low dielectric constant porous polymer PAE thin films,” Now at Intel, Los Angeles, CA.
Judy Pei-Yao Liu, 2000 Thesis title "Microstructure and property of Organically Modified Silicate Film Used for Interlayer Dielectric with Low dielectric Constant." Now at Applied Materials, Hsinchu, Taiwan, ROC.
Quyen Tang Huynh, 2000 Thesis title "Electromigration Study in PbSn Solder Lines." Now at Intel, Los Angeles, CA.
Gu Xu, 11/01, Thesis title "Effect of electromigration in V-shaped solder lines." Now at Dept. MSE, UCLA.
Cindy Wan-Ying Ma, 2002 Thesis title "The synthesis and characterization of porous low-k methylsilsesquioxane films for interlayer dielectric applications."
Jongsung Kim, 2002 Thesis title "Flow kinetics of molten Pb-free solders along V-groove etched on (001) Si surface." Now at UCLA.
Seung-Yub Lee, 2003 Thesis Title "Synthesis and Characterization of Organically Modified Silicates Thin Film for Low Dielectric Constant Materials." Now at Caltech.
Xi Zhang, 2004 Thesis Title, “Electroless Ni metallization of macro-porous silicon for the application to cross-talk isolation in mixed signal integrated circuits.” Now a Ph. D. candidate in Dept. of MSE, UCLA.
Minyu Yan, 2005 thesis on "The effect of immersion and evaporated Sn coating on the electromigration failure mechanism and lifetime of Cu damascene interconnects." Now a Ph. D. student in UCLA.
Mr. Rajat Agarwal, 2005 Thesis Title, "Electromigration in eutectic SnPb V-groove solder lines at 100 C." Now at Intel, Santa Clara, CA.
To see more detail information, please go to this webpage:
http://www.seas.ucla.edu/ms/faculty1/tu.html
232 comments:
«Oldest ‹Older 201 – 232 of 232Spot on with this write-up, I absolutely think this web site
needs a great deal more attention. I'll probably be returning to read more, thanks for the information!
Here is my webpage get followers
xanax online fastest way pass drug test xanax - xanax home drug test
Sacs Louis Vuitton
sac louis vuitton pas cher
Pas Cher Louis Vuitton
louis vuitton pas cher
louis vuitton homme
Louis Vuitton Sac
It is pretty amazing how much of a significant difference [url=http://cungmuachung.net/thoi-trang.html]Thoi trang nam[/url] can have, of course you have to consider certain factors. So it is not unusual to find yourself doing a lot of investigation and decision making. Many people have developed more problems for themselves because they did not gather all the related facts. That is exactly why we suggest you take a look at all of your options as it relates to getting the most for your efforts. We will offer you some unique and important details on this topic so you can carefully take into account as much as possible.
The general complexities of men's and women's style
Both men and women could feel the demands of maintaining their wardrobe up-to-date and in time, yet men's fashion often seems a lot less difficult. Of course, for both sexes, outfits and style choices can be quite as complex, and there are numerous'trendy'items that could quickly become fashion faux pas - who are able to say they often see people travelling in 70s flares? On the other hand, men's fashion has a few choice items which will exist forever - which man is likely to keep an eye out of position with a good-quality, tailored suit, for example? Pick basic cuts, colours and materials and you'll never seem out-of-place.
Why traditional men's fashion is amazing
The classic man's suit has hardly changed for over a hundred years. True, there are numerous versions for different situations, but they are all popular in their quest for a clever, sharp search for the wearer. The great thing about common style for men is that it's efficiently trendy effortlessly neat. A well-groomed man will more often than not appear his sharpest in a well-tailored suit, and this is a testament to the design of such clothing. A match will undoubtedly be worn to work in several professions due to the professional search it provides to the wearer, instilling a sense of respect and confidence. Similarly a match will undoubtedly be utilized to many social occasions, like a tuxedo to a black-tie affair. This incredible versatility which allows suits to be worn in almost all situations is what gives it its timeless side and a lasting devote men's fashion.
Contemporary movements in classic men's fashion
Whilst classic men's styles will never be changed, it's interesting to note that shifts in men's fashion trends have produced particular common clothes back in fashion. The popularity of vintage clothing, especially, has brought back a wide-variety of basic models into men's closets, such as that of the dandy man. 'Dandy'is a term used to refer to men who clothe themselves in a classic yet expensive way, acting in a refined manner and placing value on appearance. This trend for almost'over-the-top'classic style for men is apparent from events like the'Tweed Run', where men and girls of all ages dress in especially Victorian-style attire and decide to try the roads on vintage cycles - with lots of the men sporting impressive mustaches! That is just one of many types of data showing the revival of such types. There are also numerous blogs on line which concentrate on gentlemanly style - such as'The Dandy Project'and'Dandyism'- as well as complete web sites such as'The Art of Manliness'dedicated to giving articles on classic men's fashion and grooming.
In conclusion, whilst certain facets of traditional men's style could be cut back as new trends, the basic outfits which they are based on will never slip out of fashion.
"All it requires are a few simple garments. And there is one secret - the easier the better." - Cary Grant
StyleGun is an online men's fashion shop with a technical angle.
Read More: [url=http://xn--12c4b1bwa7i.net/blogs/28803/103575/thoi-trang-nam-ruc-ro-tone-mau-s]thoi trang nam trung nien[/url]
http://hrltzdb.com/bbs/forum.php?mod=viewthread&tid=390403
http://www.soogay.tk/viewthread.php?tid=25703&extra=
http://www.smttcw.com/sm/boke.asp?zfbpvqfuxgv.showtopic.63572.html
http://bbs.vpsw.net/thread-33521-1-1.html
http://www.grwan.com/forum.php?mod=viewthread&tid=1233537
http://bbs.dongjunstudio.com/thread-161719-1-1.html
http://www.flm5.com/dz/forum.php?mod=viewthread&tid=114638&extra=
http://www.per-feel.com/bbs/forum.php?mod=viewthread&tid=3999785&extra=
http://www.gwygov.net/forum.php?mod=viewthread&tid=89251
http://flow.360watcher.net/bbs/forum.php?mod=viewthread&tid=114712
http://www.wedfy.com/forum.php?mod=viewthread&tid=208168
http://www.caiseqiu.com/bbs/forum.php?mod=viewthread&tid=175743
http://ozshoplink.com/forum.php?mod=viewthread&tid=231300
http://www.chinamid.cn/bbs/forum.php?mod=viewthread&tid=198707
http://www.othersidegaming.com/e107_plugins/forum/forum_viewtopic.php?268502.last
http://kakame.xtreemhost.com/viewthread.php?tid=15543&extra=
http://www.idahoducksunlimited.com/forums/topic.php?id=3169450&replies=1#post-3296100
http://49146.com/read.php?tid=12788
http://cqwenwan.com/forum.php?mod=viewthread&tid=1300535
http://www.999xp.net/forum.php?mod=viewthread&tid=7389
Hey I know this is off topic but I was wondering if
you knew of any widgets I could add to my blog that automatically tweet my newest twitter updates.
I've been looking for a plug-in like this for quite some time and was hoping maybe you would have some experience with something like this. Please let me know if you run into anything. I truly enjoy reading your blog and I look forward to your new updates.
Look at my blog :: make money at home
My spouse and I stumbled over here coming from a different web address and thought I might as well check things out.
I like what I see so i am just following you.
Look forward to finding out about your web page yet again.
my blog ... slots online games
I was wondering if you ever considered changing the page layout of your website?
Its very well written; I love what youve got to say. But maybe you could a little more in the way of content so people could connect with it better.
Youve got an awful lot of text for only having one or two images.
Maybe you could space it out better?
Review my blog post :: how to make extra money quick
xanax online what is xanax good for - xanax withdrawal symptoms headache
buy cialis online cialis online usa - review of cialis daily
cialis online cialis 10mg reviews - cheap cialis forum
Fοr latest infoгmation you have to paу
a quіcκ visіt ωorld-wide-web and on internet I founԁ thіs web page
as а finеst web ρage for latest updates.
Heгe is my homepage reginalibrary.ca
http://landvoicelearning.com/#63987 order tramadol online cod overnight - tramadol withdrawal can't sleep
learn how to buy tramdadol tramadol 50 mg strong - buy tramadol online free shipping
buy tramadol online cod overnight order tramadol legally - safe place buy tramadol online
buy tramadol online no prescription cod tramadol 100 mg m/r - buy tramadol next day delivery
buy klonopin online klonopin overdose child - klonopin good high blood pressure
http://cardiffmiller.com/pubs/buyvalium/#34206 buy valium online us - buy valium online no prescription mastercard
carisoprodol buy carisoprodol drug schedule - carisoprodol is it a narcotic
Replica HermesHermes Belts hpld Hermes BeltsHandbags Hermes crrt
LED line lights have also become hugely popular for household usage.
Consumers "going green" have already begun switching out their
incandescent bulbs for compact fluorescents, which are miniature full-sized fluorescents.
The much talked about drawback, the lack of evenly distributed light in
LED lamps too has been now satisfactorily sorted out by Sharp with
their proprietary coating technique of the glass enclosure.
Have a look at my web-site: LED Tischeleuchten
Thanks for one's marvelous posting! I definitely enjoyed reading it, you will be a great author. I will make certain to bookmark your blog and will eventually come back someday. I want to encourage you continue your great writing, have a nice holiday weekend!
Also visit my web-site exercises for vertical jump
I know this if off topic but I'm looking into starting my own weblog and was wondering what all is required to get set up? I'm assuming having a blog
like yours would cost a pretty penny? I'm not very web savvy so I'm not
100% certain. Any suggestions or advice would be greatly appreciated. Thanks
Also visit my website; salsaport.com
What's Going down i'm new to this, I stumbled upon this I've discovered It absolutely useful and it has helped me out loads. I am hoping to contribute & assist other users like its aided me. Good job.
Here is my webpage: Www.smitherscommunitydirectory.com
Saved as a favorite, I like your blog!
Feel free to surf to my page workouts For vertical jump
Hmm it looks like your blog ate my first comment (it was super
long) so I guess I'll just sum it up what I submitted and say, I'm thoroughly enjoying
your blog. I as well am an aspiring blog blogger but I'm still new to the whole thing. Do you have any suggestions for novice blog writers? I'd certainly appreciate
it.
Here is my webpage :: exercises to increase vertical leap
Informative article, exactly what I wanted to find.
Here is my webpage; how to jump higher fast
There is definately а grеat deal to leагn about this topic.
I like аll of thе pоіnts уou made.
My blog; reputation management strategies
I appreciate, result in I discovered just what
I was taking a look for. You have ended my 4 day long
hunt! God Bless you man. Have a great day. Bye
Also visit my web-site - exercises for vertical jump
Write more, thats all I have to say. Literally, it seems as though you relied on the video to make your point.
You definitely know what youre talking about, why waste your intelligence
on just posting videos to your site when you could be giving us something enlightening to read?
My webpage ... exercises to increase vertical
Thanks a bunch for sharing this with all folks you actually recognise what
you're speaking about! Bookmarked. Kindly also talk over with my website =). We could have a link alternate agreement among us
My homepage: Psn Code Generator
Hello Everybody,
My name is Ahmad Asnul Brunei, I contacted Mr Osman Loan Firm for a business loan amount of $250,000, Then i was told about the step of approving my requested loan amount, after taking the risk again because i was so much desperate of setting up a business to my greatest surprise, the loan amount was credited to my bank account within 24 banking hours without any stress of getting my loan. I was surprise because i was first fall a victim of scam! If you are interested of securing any loan amount & you are located in any country, I'll advise you can contact Mr Osman Loan Firm via email osmanloanserves@gmail.com
LOAN APPLICATION INFORMATION FORM
First name......
Middle name.....
2) Gender:.........
3) Loan Amount Needed:.........
4) Loan Duration:.........
5) Country:.........
6) Home Address:.........
7) Mobile Number:.........
8) Email address..........
9) Monthly Income:.....................
10) Occupation:...........................
11)Which site did you here about us.....................
Thanks and Best Regards.
Derek Email osmanloanserves@gmail.com
Hello Everybody,
My name is Ahmad Asnul Brunei, I contacted Mr Osman Loan Firm for a business loan amount of $250,000, Then i was told about the step of approving my requested loan amount, after taking the risk again because i was so much desperate of setting up a business to my greatest surprise, the loan amount was credited to my bank account within 24 banking hours without any stress of getting my loan. I was surprise because i was first fall a victim of scam! If you are interested of securing any loan amount & you are located in any country, I'll advise you can contact Mr Osman Loan Firm via email osmanloanserves@gmail.com
LOAN APPLICATION INFORMATION FORM
First name......
Middle name.....
2) Gender:.........
3) Loan Amount Needed:.........
4) Loan Duration:.........
5) Country:.........
6) Home Address:.........
7) Mobile Number:.........
8) Email address..........
9) Monthly Income:.....................
10) Occupation:...........................
11)Which site did you here about us.....................
Thanks and Best Regards.
Derek Email osmanloanserves@gmail.com
Post a Comment